2012年5月3日星期四

Manz steps up integration of c-Si production process with new wet-chemical tool

Purpose of the tool named IPSG CEI 4800 is to remove the highly doped layer from the backside and the edges of a wafer and thereby produce a chemical edge isolation (CEI). In a second process step the remaining phosphor silicate glass (PSG) layer on the front side of the wafer that was created during the previous diffusion process step, is removed. The newly developed soft sponge roller process concept enables faster inline transportation speeds and ensures at the same time higher process stability combined with gentle wafer handling.

As the name of the new tool implies, throughput will be high at up to 4800 w/h. The machine will be sold as a bundle with the Manz SpeedPicker for loading and unloading. Manz will follow up in its drive to become a full-process equipment supplier with new vacuum coating equipment in September and a new texturing tool soon.

Manz will produce the IPSG CEI 4800 in its new Suzhou fab which will be opened the night prior to the SNEC fair opening, on May 15, 2012. This new fab will provide German quality at local prices on 16.000 square metres of factory space, based on the company’s 20 year experience in wet-chemical processes.
 from:manz.com

1 条评论:

  1. DSP code extraction
    IC break,MCU code extraction

    chip decryption http://www.mcureverse.com
    dsp decryption http://www.dspcrack.com
    Ic break http://www.mcureverse.com
    Code extraction http://www.mcureverse.com

    回复删除